ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,815, issued on Nov. 3, was assigned to TANAKA PRECIOUS METAL TECHNOLOGIES Co. Ltd. (Tokyo). "Interposer substrate and method for producing d... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,817, issued on Nov. 3, was assigned to Lux Semiconductors Inc. (Albany, N.Y.). "Metal core substrate based package interconnect systems" was... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,818, issued on Nov. 3, was assigned to X-Celeprint Ltd. (Dublin). "Printed devices in cavities" was invented by Antonio Jose Marques Trindad... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,819, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Package substrate comprising embedded integrated device" was invented by ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,820, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Keunho ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,821, issued on Nov. 3, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "High-symmetrical semiconductor arrangement" was inve... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,822, issued on Nov. 3, was assigned to Analog Devices Inc. (Wilmington, Mass.). "Integrated electronic module with laminated bridge assembly... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,823, issued on Nov. 3, was assigned to Analog Devices Inc. (Wilmington, Mass.). "Stacked vertical power module" was invented by John David B... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,824, issued on Nov. 3, was assigned to KYOCERA Corp. (Kyoto, Japan). "Semiconductor package and semiconductor electronic device" was invente... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,825, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to reduce impedance discontinuities and cro... और पढ़ें